quectel kgm133s fixes compatibility

Physical implementation options include two LGA package footprints measuring 12.5 × 13.2 × 2.2 mm and 12.5 × 16.6 × 2.2 mm, with respective 4th‑generation IPEX or pin antenna interfaces and onboard PCB antenna configurations, while up to 26 multiplexed GPIOs support I²C, UART, SPI, and I²S peripheral connectivity for sensor integration and actuator control.

Operating temperature ratings spanning –40°C to +105°C accommodate both standard indoor deployments and semi‑harsh installation environments such as exterior‑mounted smart locks or industrial‑grade controllers, while Thread’s low‑power architecture optimization targets battery‑powered applications including wireless sensors and portable control devices requiring extended operational autonomy. The module fully supports Matter protocol which allows for seamless interoperability across different smart home ecosystems without requiring proprietary hubs. The module’s receive sensitivity better than −105 dB ensures reliable communication in challenging RF environments with physical obstructions or competing wireless traffic. Built on the Silicon Labs EFR32MG24 chip, the KGM133S incorporates an ARM Cortex-M33 processor running at maximum frequency 78 MHz alongside 256 KB SRAM and selectable Flash configurations ranging from 1,536 KB to 3.5 MB for application scalability.

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